By Jayashree Adkoli TMCnet Contributor Qualcomm Inc., a provider of wireless technologies, products and services, announced that it has sampled its first dual-CPU Snapdragon chipset, the company’s third generation of Snapdragon solutions encompassing two application processor cores running up to 1.2 GHz to power advanced smartphones. The chipset includes Mobile Station Modem “ MSM” solutions, namely MSM8260 and MSM8660. The MSM8x60 third-generation chipset from the expanded Snapdragon platform have been powering smartphones, tablets and smartbook devices in markets, said officials with the company. In precise, the MSM8260 is designed for HSPA
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